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Copper Tungsten can be used as a microelectronic materials

Mar 06, 2017

Copper Tungsten electronic packaging and heat sink material, both with low tungsten expansion characteristics, but also has the high thermal conductivity of copper, the thermal expansion coefficient and thermal conductivity can be adjusted by adjusting the composition of copper tungsten to change, thus giving copper to provide a wider Application scope. As the copper tungsten material has a high heat resistance and good thermal conductivity.

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